Tin demand from electronics soldering grew 8% YoY in Q1 2026, driven by rapid AI data center expansion and advanced semiconductor packaging. Tin-based solders remain the primary interconnection material, and AI chips require higher solder volumes per device than conventional processors.
Electronics accounts for ~50% of global tin consumption. AI infrastructure investment projected to exceed $300B in 2026 is creating meaningful new demand. Data center construction, server manufacturing, and networking equipment all consume significant tin solder, partially offsetting weaker consumer electronics.
The ITA projects global refined tin demand growth of 3.5% in 2026. Combined with constrained supply from Myanmar and Indonesia, this supports the view that the tin market is entering a structural deficit phase. Coface projects the first refined deficit since 2021, with structural tightness persisting.